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  • Freescale
  • PowerQUICC Communications Processors
  • PowerQUICC II (82xx)
  • MPC8250

MPC8250: PowerQUICC II Integrated Communications Processor


http://www.freescale.com/webapp/sps/site/prod_summary.jsp?code=MPC8250
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Built on PowerThe PowerQUICC II™ integrated communications processor family delivers excellent integration of processing power for networking and communications peripherals, providing customers with an innovative, total system solution for building high-end communications systems. Freescale Semiconductor's PowerQUICC II processor family is the next generation of the leading PowerQUICC™ line of integrated communications processors, providing higher performance in all areas of device operation, including greater flexibility, extended capabilities, and higher integration.

Freescale's leading PowerQUICC architecture integrates two processing blocks. One block is a high-performance embedded G2 core and the second block is the Communications Processor Module (CPM). The CPM of the MPC8255 processor can support up to two fast serial communications controllers (FCCs), one multichannel controller (MCC), four serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI) and one I2C interface. The combination of the G2 core and the CPM, along with the versatility and performance of the PowerQUICC II processor family, provides customers with enormous potential in developing networking and communications products while significantly reducing time-to-market development stages.

View Block Diagram

Features


Product Highlights

  • 300 MHz high-speed embedded G2 core
  • Powerful memory controller and system functions
  • Enhanced 32-bit RISC communications processor module
  • Up to two multiport 10/100 Mbps ethernet MAC
  • Up to two UTOPIA II ATM interfaces
  • Up to 128 HDLC channels (each channel 64 Kbps, full duplex)
  • Up to four 10 Mbps ethernet MAC
  • Strong 3rd-party tools support from Freescale's Smart Networks alliance members

Typical Applications

  • Remote Access Concentrators
  • Regional Office Routers
  • Cellular Infrastructure equipment
  • Telecom Switching Equipment
  • Ethernet Switches
  • T1/E1-to-T3/E3 Bridges
  • xDSL Systems

Technical Specifications

  • Embedded G2 core at 300 MHz
    • 570 MIPS at 300 MHz (Dhrystone 2.1)
    • High-performance, superscalar microprocessor
    • Disable CPU mode
    • Supports the Freescale external L2 cache chip (MPC2605)
    • Improved low-power core
    • 16 Kbyte data and 16 Kbyte instruction cache
    • Memory Management Unit
    • Floating Point Unit
    • Common On-chip Processor (COP)
  • System Interface Unit (SIU)
    • Memory controller, including two dedicated SDRAM machines
    • PCI up to 66 MHz
    • Hardware bus monitor and software watchdog timer
    • IEEE 1149.1 JTAG test access port
  • High-Performance CPM with operating frequency of 133 MHz
    • Parallel I/0 registers
    • On-board 32 Kbytes of dual-port RAM
    • One multichannel controller (MCC), each supporting 128 full-duplex, 64 Kbps, HDLC lines
    • Virtual DMA functionality
    • Two FCCs supporting 10/100 Mbps Ethernet (up to two) (IEEE 802.3X with Flow Control)
    • Three MII interfaces
    • Four TDM interfaces (T1/E1) supporting four T1 lines or one T3 line
  • Two bus architectures: one 64-bit 60x bus and one 32-bit PCI or local bus
    • Integrated PCI interface
  • 1.8V or 2.0V internal and 3.3V I/O
  • 300 MHz power consumption: ~3 W
  • 480 TBGA package (37.5 x 37.5 mm)

MPC8260 Derivatives

 
8250
8255
8260
8264
8265
8266
Serial Communications Controllers (SCCs)
4
4
4
4
4
4
Fast Communication Controllers (FCCs)
3
2
3
3
3
3

I-Cache (Kbyte)

16
16
16
16
16
16
D-Cache (Kbyte)
16
16
16
16
16
16
Ethernet (10T)
Up to 4
Up to 4
Up to 4
Up to 4
Up to 4
Up to 4
Ethernet (10/100)
Up to 3
Up to 2
Up to 3
Up to 3
Up to 3
Up to 3
UTOPIA II Ports
0
2
2
2
2
2
Multi-Channel HDLC
Up to 128
Up to 128
Up to 256
Up to 256
Up to 256
Up to 256
PCI Interface
Yes
--
--
--
Yes
Yes
IMA Functionality
--
--
--
Yes
--
Yes

PowerQUICC II Masks and Versions

Process
Family
Revision
Qualification
Mask
PVR
IMMR_ [16-31]1
Rev_Num2
0.29 µm (HiP3)
MPC8260
A.1
XC
0K26N
0x00810101
0x0011
0x0001
B.3
XC
3K23A
0x00810101
0x0023
0x003B
C.2
XC
6K23A, 7K23A
0x00810101
0x0024
0x007B
0.25 µm (HiP4)
A.0
XC
2K25A
0x80811014
0x0060
0x000D
B.1
MC
4K25A
0x80811014
0x0062
0x002D
C.0
MC
5K25A
0x80811014
0x0064
0x002D
0.13 µm (HiP7)
MPC8280
0.0
—
0K49M
0x80822011
0x0A00
0x0070
0.1
MC
1K49M
0x80822013
0x0A01
0x0070
A.0
MC
2K49M
3K49M
0x80822014
0x0A10
0x0071
MPC8272
0.0
PC
0K50M
0x80822013
0x0C00 3
0x0D00 4
0x00E0
A.0
MC
1K50M
0x80822014
0x0C10 3
0x0D10 4
0x00E1

Notes:
1. The IMMR[16-31] indicates the mask number.
2. The Rev_Num located at offset 0x8AF0 in DPRAM indicates the CPM microcode revision number.
3 . Encryption Enabled.
4 . Encryption Disabled.

Masks and versions table last updated on 14OCT2004.

Product Specifications

Core - Type603e, 603e, 603e, 603e
Core - Number of Cores - Spec1, 1, 1, 1
Co Processor TypeCPM
Co Processor Frequency - Max (MHz)166, 200, 133
Cache (kByte)32
I/O Operating Voltage - Max (V)3.3
Bus InterfaceLocal, 60x, PCI
Ambient Operating Temperature (Ta) - Max (°C)105
Ambient Operating Temperature (Ta) - Min (°C)0, -40
Junction Operating Temperature - Max (°C)(Tj)105
Power Dissipation - Max (W)2.1, 2.9, 2.8, 3.1, 3.2, 1.9
Power Dissipation - Typ (W)1.3, 2.3, 2.2, 2, 2.4, 2.5, 1.5

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