This EVALUATION KIT features the MC33661 Local Interconnect Network (LIN), which is a serial communication protocol interface device designed to support automotive networks in conjunction with the Local Interconnect Network (LIN). As the lowest level of a hierarchical network, LIN enables cost-effective communication with sensors and actuators when all the features of CAN (Controller Area Network) are not required.
The 33661 is a Physical Layer component dedicated to automotive LIN subbus applications. It offers slew rate selection for optimized operation at 10 kbps and 20 kbps, fast baud rate (above 100 kbps) for test and programming modes, excellent radiated emission performance, and safe behavior in the event of LIN bus short-to-ground or LIN bus leakage during low-power mode.
This kit is supplied for preliminary evaluation purposes. This evaluation kit was populated with a production (MC33661D) device and datasheet. Current revision of the data sheet available on Web.
Features
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Operational from VSUP 6.0 V to 18 V DC, Functional up to 27 V DC, and Handles 40 V During Load Dump
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Active Bus Waveshaping Offering Excellent Radiated Emission Performance
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5.0 kV ESD on LIN Bus Terminal
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30kΩ Internal Pullup Resistor
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LIN Bus Short-to-Ground or High Leakage in Sleep Mode
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-18 V to +40 V DC Voltage at LIN Terminal
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8.0μA Standby Current in Sleep Mode
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Local and Remote Wake-Up Capability Reported by INH and RXD Terminals
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5.0 V and 3.3 V Compatible Digital Inputs Without Any External Components Required
Featured Documentation
- MC33661: MC33661, Local Area Network (LIN) Enhanced Physical Interface with Selectable Slew Rate
Kit Contains
- Assembled and tested evaluation board/module in anti-static bag.
- CD-ROM containing:
- Supporting Documentation for featured device (may include datasheet, user's guides, app notes...etc)
- Schematic of evaluation board
- Bill-of-Material for evaluation board
- Instruction sheet for evaluation board
- Software and configuration files (if applicable)
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