KLM is Freescale's back-end—bump, assembly and test—facility in Kuala Lumpur, Malaysia. It is one of two Freescale-owned mega-sites for testing and packaging chips. The 750,000-square-foot factory was established in 1972. Key packaging technologies include plastic ball grid arrays (PBGA), tape ball grid arrays (TBGA), quad flat pack packages (QFP), plastic leaded chip carrier (PLCC), RF components and hybrid modules.
