| Year |
Month |
Conference |
Paper |
Topic |
File Size |
File Format |
| 2006 |
May |
Third iNEMI Sn Whisker Workshop |
A Finite
Element Study of Strain Energy Density Distribution Near A Triple Grain
Junction and Its Implication on Whisker Growth |
Environmental Product Packaging |
256 KB |
PDF |
| 2005 |
Jun |
55th Electronic Components and Technology Conference |
Effects of Reflow on the Microstructure and Whisker Growth Propensity of Sn Finish |
Environmental Product Packaging |
394 KB |
PDF |
| 2005 |
Jun |
55th Electronic Components and Technology Conference |
Effects of Trim and Form on the Microstructure and Whisker Growth Propensity of Sn Finish |
Environmental Product Packaging |
518 KB |
PDF |
| 2005 |
Jun |
55th Electronic Components and Technology Conference |
Microstructure-based Stress Modeling of Tin Whisker Growth |
Environmental Product Packaging |
674 KB |
PDF |
| 2005 |
Jun |
Elektronik EXTRA |
"Pb-free“ ante portas - No End for Conventional SnPb Board Soldering
"Pb-frei" ante portas - Kein Ende für konventionelles SnPb auf Leiterplatten |
Environmental Product Packaging |
122 KB |
PDF |
| 2005 |
May |
2nd iNEMI Sn Whisker Workshop |
A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity Storage Tests |
Environmental Product Packaging |
591 KB |
PDF |
| 2004 |
Sept |
'New Requirements for Systems at Elevated Temperatures in Automotive', HdT/RWTH Aachen, Essen, Germany |
Risks and Opportunities of Pb-free Solder Terminals and Packaging for Processability at Elevated Temperatures |
Environmental Product Packaging |
17942 KB
|
PDF |
