Freescale's manufacturing expertise concentrates on
two areas: die manufacturing, and packaging and test. Our die
manufacturing specializes in a broad range of process technologies
including leading-edge
CMOS and SOI.
Our package and test expertise includes flip chip,
wire bond, ball grid arrays, multi-die modules, RF packaging and
advanced test development. In our product manufacturing processes, we
emphasize lowering cost, reducing cycle time and accelerating new
product introductions. We have seven wholly owned die manufacturing
facilities and two final manufacturing
sites.
Freescale also partners with external Foundry's for high volume production of standard and Custom SoCs. These partners include:
