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Packaging

Freescale Semiconductor has over 30 years of leadership in semiconductor packaging and manufacturing technology for automotive, industrial, networking and wireless markets and offers industry-leading packaging options spanning from low-cost solutions to high-end flip-chip BGAs (FCPBGAs). Freescale actively supports the need for environmentally safe products and has an Environmentally Preferred Product (EPP) program to help ensure customer and legislative requirements are met. Freescale packaging options include MAPBGAs, PBGAs, TEPBGAs, TBGAs and FCPBGAs.

Freescale has also introduced the latest Redistributed Chip Packaging (RCP) technology. You can directly visit the RCP technology page for further information.

Customer Notice

  • Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010:
    i.MX Product Family,
    DragonBall Product Family

MAPBGA (Molded Array Process Ball Grid Array)

The wire-bonded MAPBGA (Molded Array Process Ball Grid Array) is an excellent package for low-performance to mid-performance devices that require packaging with low inductance, ease of surface mounting, low cost, small footprint and excellent package reliability.

Features:
  • Custom substrate designs / ball maps for maximum flexibility and electrical performance
  • Custom ball patterns / full array / depopulated arrays available; 0.5 mm to 1.0 mm pitch
  • Substrates use standard PCB manufacturing technology
  • Two or four layer substrates available (ground / power planes)
  • High I/O with smaller footprints available
  • Maximum thickness from 1.30 mm to 1.60 mm
  • Capability to withstand lead-free reflow processes (260°C reflow)
  • Lead-free solder balls available (95.5% Sn, 4% Ag, 0.5% Cu)

PBGA (Plastic Ball Grid Array)

The wire-bonded PBGA (Plastic Ball Grid Array) package is an excellent package for mid- to high-performance devices that require low inductance, ease of surface mounting, relatively low cost, and excellent package reliability. Additional copper layers in the substrate allow for increased power dissipation capability with the Thermally Enhanced PBGA (TEPBGA).

Features:
  • Custom substrate designs / ball maps for maximum routing flexibility and electrical performance
  • Custom ball patterns / full arrays / depopulated arrays available
  • Substrates use standard organic PCB manufacturing technology
  • Two or four layer substrates available (ground / power planes)
  • Proven reliability in automotive / industrial environments
  • Capability to withstand lead-free reflow processes (260°C reflow)
  • Lead-free solder balls available (95.5% Sn, 4% Ag, 0.5% Cu)

TEPBGA (Thermally Enhanced Plastic Ball Grid Array)

In the TEPBGA a thermally enhanced substrate acts to spread and draw heat from the die to the customer board. For further power dissipating capability, a heat spreader is placed on top of the die, within the mold compound of a PBGA, drawing heat to the surface of the package.

Features:
  • Proven reliability in industrial environments
  • Capability to withstand lead-free reflow processes (260C reflow)
  • Lead-free solder balls available (95.5% Sn, 4% Ag, 0.5% Cu)
  • Builds upon the standard PBGA process
  • Overall substrate thickness increased over two-layer
  • Additional epoxy dispense, heat spreader placement, epoxy cure steps needed
  • Substrate design must account for heat spreader design to allow for attachment area

TBGA (Tape Ball Grid Array)

The TBGA (Tape Ball Grid Array) is a mid to high end BGA packaging solution for applications needing excellent thermal performance without an external heatsink.

Features:
  • Improved thermal performance over std PBGA packages <15°C/Watt
  • Custom substrate designs / ball maps for maximum flexibility and electrical performance
  • Custom ball patterns / depopulated arrays available; 1.0 mm to 1.27 mm pitch
  • Substrates use standard PCB manufacturing technology
  • Maximum thickness from 1.30 mm to 1.60 mm
  • Fine Lines/Spacing Geometry (35/35 µm) on two sides of polyimide substrate
  • Capability to withstand lead-free reflow processes (260C reflow)
  • Lead-free solder balls available (95.5% Sn, 3.8% Ag, 0.7% Cu)

FCPBGA (Flip Chip Plastic Ball Grid Array)

Our FCPBGA (Flip Chip Plastic Ball Grid Array) is a laminate-based BGA packaging solution. The FCPBGA provides competitive solutions for higher performance applications.

Features:
  • Improved board level solder joint reliability and lower cost compared to FC CBGA
  • Custom substrate designs / ball maps for maximum routing flexibility and electrical performance
  • Custom ball patterns / full arrays / depopulated arrays available
  • Substrates use standard organic PCB manufacturing and HDI laminate technologies
  • FCPBGA footprint is a drop-in replacement (PCB design and board assembly) for WB PBGA for the same ball diameter and pitch.
  • Production qualified MSL 3 at 245°C reflow

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