Live Chat Not Available: Create Service Request

Lead Frame Packaging Technology


This simple and typically low cost packaging is still the best solution for many applications. Freescale offers a full range of these packages including the innovative Quad Flat No-lead (QFN) package family.

QFP (Quad Flat Pack), LQFP (Low Profile Quad Flat Pack), TQFP (Thin Quad Flat Pack)

The Quad Flat Pack (QFP) package is a surface mounted plastic package with peripheral leads on four sides. Variants include the Low Profile (LQFP) and Thin (QFP) applications needing thinner packages.

Features:
  • Cost effective reliable package
  • Package size 4 mm up to 32 mm
  • Thin profile down to 1.0 mm for TQFP
  • Lead pitches 0.4 mm, 0.5 mm, 0.65 mm and 0.8 mm
  • Proven reliability in automotive / industrial environments
  • Capability to withstand lead–free reflow processes (260C reflow)
  • Exposed pad options available depending on device requirements and intended application

QFN (Quad Flat No–Lead)

The quad flat no-lead (QFN) package is a surface mount plastic package with lead pads located on the bottom surface of the package. The QFN is ideal for analog power switching, automotive and infrastructure applications.

Features:
  • Cost-reduced, smaller packages with high thermal dissipation/low Ron
  • Package size of 2x2 mm up to 12x12 mm
  • Thin profile of 0.65 mm to 1.00 mm
  • Designed with a single exposed die pad (flag) depending on device requirements and intended application
  • Proven reliability in automotive / industrial environments
  • Capability to withstand lead–free reflow processes (260C reflow)

For more information, read the AN1902 Quad Flat Pack No-Lead (PQN) application note (PDF).

PQFN (Power Quad Flat No–Lead)

The power quad flat no-lead (PQFN) package is a surface mount plastic package with lead pads located on the bottom surface of the package. The PQFN is ideal for analog power switching, automotive and infrastructure applications.

Features:
  • Cost-reduced, smaller packages with high thermal dissipation/low Ron
  • Designed with a single exposed die pad (flag) or multiple exposed die pads depending on device requirements and intended application
  • Capability to withstand lead–free reflow processes (260C reflow)

For more information, read the AN2467 Power Quad Flat No-Lead (PQFN) Package application note (PDF).

Additional Lead Frame Packaging

Freescale offers a wide variety of other lead frame package types including PLCC (Plastic Leaded Chip Carrier), SOIC (Small Outline Integrated Circuit), and TSOP (Thin Small Outline Package).

Features:
  • Cost effective reliable packages
  • Proven reliability in automotive / industrial environments
  • Capability to withstand lead–free reflow processes (260C reflow)

Return to Top Return to Top