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Broadcast Solutions
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Advanced Technology to Maximize Broadcast Transmitter Performance

Enhanced Ruggedness 50V LDMOS Technology
Freescale's latest generation of enhanced ruggedness 50V LDMOS devices brings the broadcast system designer unprecedented ruggedness combined with industry-leading performance. Freescale's enhanced ruggedness line of broadcast devices are designed to handle operating into a voltage standing wave ratio (VSWR) greater than 65:1. These attributes allow broadcast transmitter designers to meet the most challenging performance and reliability demands of today's broadcast industry.

Freescale's innovative low thermal resistance packaging technology enables higher device power densities for even the highest power designs. High device power density, combined with the high-power gain offered by Freescale's portfolio of 50V LDMOS devices simplifies designs by reducing the number of driver and output stages needed, thereby increasing reliability and reducing cost.

The breadth of our high power portfolio enables broadcast transmitter designers to choose an optimal solution, capable of meeting or exceeding even the most rigorous performance requirements across any desired power level, modulation type and frequency range. The exceptional efficiency and gain cover virtually every broadcast transmitter application, including analog television, DVB-T, ISDB-T and ATSC digital television as well as AM, single sideband, FM, HD and DAB radio applications.

Freescale's RF broadcast solutions cover frequencies from 1.8 to 860 MHz with power outputs from 10 watts to an industry-leading 1250 watts.

Freescale's broadcast devices are designed to meet quality and reliability standards demanded by even the most quality-conscious transmitter manufacturers and operators.

Advantages
  • More than 50 years of experience delivering solid state solutions for broadcast applications
  • Proven product quality, reliability and consistency
  • Comprehensive portfolio, serving both driver and output stages
    • Power levels from 10W to 1250W
    • Frequency coverage from 1.8 to 860 MHz
  • Broadest line of enhanced ruggedness devices
    • Field proven enhanced ruggedness process
    • Capable of handling >65:1 VSWR with 3 dB overdrive
    • Devices from 300W to 1250W
    • Frequency coverage from 1.8 to 860 MHz
  • Enhanced ESD protection
  • Superior thermal performance
  • Cost-effective, high performance plastic package options
  • RoHS compliant
  • Secure, high volume manufacturing capability
  • Long term commitment to all broadcast products with minimum 10 years of product availability from introduction
  • Regional broadcast applications support teams

Product Performance Table for Freescale 50 V Broadcast Devices

 Link  HF/VHF            Link  UHF
RF Power Broadcast Portfolio
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HF/VHF Broadcast
Part Number Voltage
(V)		 Operating
Frequency
(MHz)		 P1dB
(W)		 Technology Package ΘJC
°C/W(1)		 Typical
Gain
(dB)		 Typical
Efficiency
(%)		 Reference Designs(2)
and Demo Boards (MHz)
MRF6V2010N/NB 50 10-450 10 VHV6 Over-Molded 3 23.9 62 CW: 27, 87.5-108 FM, 130, 220, 450
MRF6V2150N/NB 50 10-450 150 VHV6 Over-Molded 0.24 25 68.3 CW: 27, 87.5-108 FM, 220, 450
Pulsed: 130
MRFE6VP6300H/HS 50 1.8-600 300 EVHV6
Enhanced
Ruggedness		 Air Cavity 0.19 25 80 CW: 87.5-108 FM, 230, 500
Pulsed: 130, 450
MRF6V2300N/NB 50 10-600 300 VHV6 Over-Molded 0.24 25.5 68 CW: 27, 87.5-108 FM, 130, 425, 450
Pulsed: 170-230 Analog, 220
MRF6V4300N/NB 50 10-600 300 VHV6 Over-Molded 0.24 22 60 CW: 450
MRFE6VP5600H/HS 50 1.8-600 600 EVHV6
Enhanced
Ruggedness		 Air Cavity 0.12 24.6 75.2 CW: 230
Pulsed: 175-225, 230
MRF6VP2600H 50 2-500 600 VHV6 Air Cavity 0.20 25/125 W
(DVB-T)		 28.5/125 W
(DVB-T)		 CW: 87.5-108 FM
Pulsed: 175-225 Analog, 225
MRF6VP11KH 50 10-150 1000 VHV6 Air Cavity 0.13 26 71 CW: 81, 87.5-108 FM, 100, 130
Pulsed: 15, 27
MRF6VP41KH/HS 50 10-500 1000 VHV6 Air Cavity 0.15 20 64 CW: 352
Pulsed: 450
MRFE6VP61K25H/HS 50 1.8-600 1250 EVHV6
Enhanced
Ruggedness		 Air Cavity 0.15 22.9 74.6 CW: 87.5-108 FM, 500
Pulsed: 170-230, 230, 352

UHF Broadcast		  [Top]
Part Number Voltage
(V)		 Operating
Frequency
(MHz)		 P1dB
(W)		 Technology Package ΘJC
°C/W(1)		 Typical
Gain
(dB)		 Typical
Efficiency
(%)		 Reference Designs(2)
and Demo Boards (MHz)
MRF6V3090N/NB 50 470-860 90 VHV6 Over-Molded 0.79 22/18 W 28.5/18 W CW: 470-860
MRF6VP3091N/NB 50 470-860 90 VHV6 Over-Molded 0.79 22/18 W 28.5/18 W CW: 470-860
MRF6VP3450H/HS 50 470-860 450 VHV6 Air Cavity 0.23 22.5/90 W
(DVB-T)		 28/90 W
(DVB-T)		 Pulsed: 470-860
MRFE6VP8600H/HS 50 470-860 600 EVHV6
Enhanced
Ruggedness		 Air Cavity 0.19 19.3/125 W
(DVB-T)
18.8/600 W
(Pulsed)		 30
48.9		 Pulsed: 470-860, 860
(1) Refer to the respective part number data sheet for thermal measurement operating conditions. 
(2) Reference designs for broadcast parts are available at: www.freescale.com/RFbroadcast > Design Support > Reference Designs.
Note: To order Freescale RF broadcast high power devices use Freescale's Orderable Part search feature to locate a part. Select the Distributor button under Order on the search results page to locate a listing of Distributors who can facilitate your order.

RF Power FM/VHF/UHF Broadcast

RF Broadcast 1.25 kW Lineup
RF Broadcast 450 W Lineup

Design Support

MTTF Calculation Programs

Freescale's MTTF/FIT calculator software is designed to assist our customers in estimating the LDMOS device reliability in terms of electromigration wear-out failures. The program evaluates LDMOS device Median-Time-To-Failure (MTTF) using Black's Equations.


Reference Designs

Freescale Semiconductor is pleased to offer application-specific reference designs. These application-specific reference designs show some of the many possible uses of our high power RF transistors. They provide the customer's design engineers with a fast and accurate tool to both evaluate the performance envelope and fully characterize the devices under a variety of different operating conditions.

For additional information and/or availability contact your local Freescale Sales Office or Freescale Authorized Distributor.

Part Number Reference Designs
MRFE6VP61K25H/HS 87.5-108 MHz, 1100 W CW, 50 V FM Broadcast Reference Design
170-230 MHz, 225 W Avg., 50 V VHF Digital TV Broadcast Reference Design
144-148 MHz, 1250 W CW, 50 V 2 Meter Amateur Reference Design

Demo Boards

Freescale makes RF PCB drawing files available that contain layout and assembly information with line widths and fixed package dimensions to ensure proper impedance matching at each device terminal.

For additional information and/or availability contact your local Freescale Sales Office or Freescale Authorized Distributor.

HF/VHF Broadcast
Part Number Demo Board Options
(MHz)
MRF6V2010N/NB CW: 27, 87.5-108 FM, 130, 220, 450
MRF6V2150N/NB CW: 27, 87.5-108 FM, 220, 450
Pulsed: 130
MRFE6VP6300H/HS CW: 87.5-108 FM, 230, 500
Pulsed: 130, 450
MRF6V2300N/NB CW: 27, 87.5-108 FM, 130, 425, 450
Pulsed: 170-230 Analog, 220
MRF6V4300N/NB CW: 450
MRFE6VP5600H/HS CW: 230
Pulsed: 175-225, 230
MRF6VP2600H CW: 87.5-108 FM
Pulsed: 175-225 Analog, 225
MRF6VP11KH CW: 81, 87.5-108 FM, 100, 130
Pulsed: 15, 27
MRF6VP41KH/HS CW: 352
Pulsed: 450
MRFE6VP61K25H/HS CW: 87.5-108 FM, 500
Pulsed: 170-230, 230, 352

UHF Broadcast
Part Number Demo Board Options
(MHz)
MRF6V3090N/NB CW: 470-860
MRF6VP3091N/NB CW: 470-860
MRF6VP3450H/HS Pulsed: 470-860
MRFE6VP8600H/HS Pulsed: 470-860, 860

RF High Power Models
  • ADS
    Freescale Semiconductor continues to release RF High Power product models (FET2 , MET and Root models). All product models include package, bond wire and internal matching network effects.
    Access FET2, MET and Root models for Agilent EEsof ADS® nonlinear circuit simulator.
     
  • AWR Microwave Office®
    Freescale Semiconductor continues to release RF High Power product models (FET2 and MET models). All product models include package, bond wire and internal matching network effects.
    Access FET2 and MET models for AWR Microwave Office® nonlinear circuit simulator.


Application Notes
  • AN1907 — Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages
  • AN1908 — Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages
  • AN3263 — Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages
  • AN3789 — Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages

Freescale Competitive Advantages

Industry-Leading Packaging
  • Thermal performance leadership
  • Package design
  • Freescale JEDEC-registered TO series is the only over-molded plastic package series specifically designed for high power RF applications
    • Bolt down, clamp down and solder reflow mounting options
    • Low thermal resistance flange material
    • 225°C TJ maximum operating temperature
    • Power dissipation capabilities >1 kW
    • In-package impedance matching
    • Low Au solderable finish for improved reliability
    • Plastic package with a larger contact area for optimal thermal performance

RF Broadcast Chip Set
  • Manufacturing
    • Automated high volume assembly and test
    • Multiple manufacturing locations
  • Materials
    • RoHS compliant
Why Choose Freescale?
  • Best-in-class RF performance
  • Industry-leading package designs
  • Consistent and repeatable RF performance
  • Consistent high quality
  • Proven long-term reliability
  • High volume manufacturing capability
  • Assured long-term supply
  • Comprehensive, in-region design support

Events

  • IMS 2013
    June 2-7, 2013
    WA State Convention & Trade Center, Seattle, WA

Training

Related Documents


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