Freescale's highly integrated Power Management Integrated Circuit PMIC (SC900841JVK), is optimized for ultra-mobile platforms that are driving next generation integration of such elements as Audio, Battery Charging, LED drivers, Touch-Screen Interface, RTC, SPI, GPIO, GPO, USB-OTG, ADC, LDO and Switching Regulators.
It has nine switching power supplies running at frequencies from 1.0 to 4.0 MHz,17 highly-efficient LDOs and three, 3.3 V power switches. It incorporates a switching mode Li-Ion battery charger, advanced audio path, signaling and backlight LED drivers, 22-channel ADC, real time clock, 8 GPIO, 8 GPO, and 4 GPOSW for specific platform switches control.
It is fully configurable and controllable through its SPI and Mini SPI interfaces. Along with a Buck-Boost DC/DC and LDO Power Management IC companion chip, which provides an optimized power management solution for ultra-mobile platforms used on Mobile Internet Devices (MID), netbooks, slates, smart phones and other high-tech portable devices.
Optimum partitioning, high feature integration, and state of the art technology, enable Freescale to effectively serve multiple mobile market segment which enhance the user experience, including power efficiency, product innovation, and novel functionality.
Freescale offers a fully integrated, 4-switch synchronous Buck-Boost DC/DC regulator and a low noise, low dropout linear regulator (LDO). The PMIC (SCCSP900842) provides seamless transition between Buck and Boost modes to control input voltages from 3.0 to 4.4V at a fixed output of 3.3V.
The internal configuration also provides two pins to monitor the status of the IC: a digital status signal, and an analog voltage proportional to the average output current. It is supplied from a single Li-Ion battery cell, and steps up or down an input voltage range of 3.0 to 4.4 V to provide a fixed output voltage of 3.3 V. It provides two pins to monitor the status of the IC: a digital status signal, and an analog voltage proportional to the average output current. The device is housed in a 3x3 mm, Pb-free, wafer level chip scale package (WLCSP) with a 0.4 mm pitch.