Because of an order from the United States International Trade Commission (ITC), certain BGA-packaged products currently are not available from Freescale Semiconductor for sale or import into the United States until 24 September 2010. The ITC order does not prevent Freescale from marketing or selling affected products outside of the U.S.
Freescale apologizes for any inconvenience this may cause you as we address the requirements of the order.
For more information about affected products and alternate solutions for your design needs, please contact your Freescale sales representative.
Background on the ITC Order
On 20 May 2009, the ITC issued a ruling indicating six companies, including Freescale, infringed two U.S. patents relating to chip packaging technology. The Commission’s decision reverses a ruling made by an ITC administrative law judge in December that Freescale and others did not infringe the specific chip packaging patents. Freescale continues to contend that the claims are without merit and will continue to defend itself against these types of allegations.
The order from the ITC specifically affects certain Freescale BGA-packaged products (except flip chip, package-in-package, or tape based products) having a solder ball pitch of less than 1.27 mm, at least 36 solder balls (at least one of which is located under the die), and a die attach modulus of less than 3.5GPa.
