Manufacturing

Freescale's manufacturing expertise concentrates on two areas: die manufacturing, and packaging and test. Our die manufacturing specializes in a broad range of process technologies including CMOS and SOI, as well as specialty technologies such as SiGe:C, SMARTMOS technology and Sensors. Our package and test expertise includes flip chip, wire bond, ball grid arrays, multi-die modules, RF packaging and advanced test development. In our product manufacturing processes, we emphasize lowering cost, reducing cycle time and accelerating new product introductions. We have five wholly owned die manufacturing facilities, and two final manufacturing sites.