Available in the ultra-small 1.9 x 2.0 mm wafer-level chip scale package, the Kinetis KL02 CSP (MKL02Z32CAF4R) drastically reduces board space while retaining rich MCU feature integration. The KL02 CSP consumes 25 percent less PCB area, yet delivers 60 percent more GPIO than nearest competing MCU.
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The i.MX 6 series unleashes a scalable multicore platform that includes single-, dual- and quad-core families based on the ARM® Cortex™-A9 architecture. With high-performance processing, pin- and software-compatible product families, integrated power management, and bleeding-edge graphics and video, the i.MX 6 series provides a new level of multimedia performance to enable an unbounded user experience.