Freescale maintains a broad spectrum of manufacturing capabilities to meet the needs of its automotive, wireless and networking customers. To meet these customer needs, Freescale combines strategic internal and external manufacturing sources. Our company has consolidated its manufacturing facilities into fewer, more efficient manufacturing operations. Today, Freescale has four front-end wafer manufacturing sites, and two back-end assembly and test operations.
Freescale's die manufacturing capabilities include advanced CMOS, silicon-on-insulator, as well as specialty technologies such as SMARTMOS power amplifiers, RF Analog, mixed–signal, and Sensors. Freescale continues our long-term investment into advanced technologies such as Analog SMARTMOS, Sensors, Through-Silicon-Via (TSV), and Radar.
Freescale's packaging expertise includes standard leadframe, flipchip, ball grid array, multi-die, RF, Sensor packages and RCP. Test expertise include digital, analog and high–performance test, as well as advanced test development.
In our product manufacturing processes, we emphasize lowering cost, reducing cycle time and accelerating new product introductions.
Freescale's Austin Technology & Manufacturing Center is an 8-inch wafer manufacturing facility in Austin, Texas. In production since 1995, the 120,000-square-foot factory manufactures MCU/MPU devices for power management, e-switch and RF amplifier applications. End-markets include automotive, networking and multimedia for such applications as engine controllers, safety systems, routers and e-readers.
Freescale's Chandler Fab is an 8-inch wafer manufacturing facility in Chandler, Arizona. In production since 1993, the 158,000-square-foot facility manufactures microcontrollers, power/mixed signal devices, and embedded split-gate Flash memories for automotive and consumer markets. End-market applications include engine/transmission controllers, safety systems, auto body electronics and home appliances. In addition, the factory includes an electroplate manufacturing (EPM) facility specializing in electroplating and wafer thinning in support of all Freescale wafer fabs.
Freescale's Oak Hill Fab is an 8-inch wafer manufacturing facility in Austin, Texas. In production since 1991, the 100,000-square-foot factory makes analog/mixed signal devices for power management, e-switch and RF amplifier applications. End-markets include automotive and wireless infrastructure for such applications as start-stop alternator switching, automotive airbag systems and other auto body-control applications. In addition, the factory has a MEMs line that produces both inertial and pressure-sensing devices that support tire pressure monitoring, automotive airbag and hand-held commercial devices such as smartphones and gaming applications.
Freescale's back-end (assembly and test) Final Manufacturing facility in Kuala Lumpur, Malaysia, is one of two Freescale-owned mega-sites for testing and packaging chips. In production since 1972, key packaging technologies made at the 750,000-square-foot factory include plastic ball grid arrays (PBGA), tape ball grid arrays (TBGA), quad flat pack packages (QFP), plastic leaded chip carrier (PLCC), RF components and hybrid modules.
Freescale's back-end (assembly and test) Final Manufacturing facility in Tianjin, China, is one of two Freescale-owned mega-sites for testing and packaging chips. In production since 2001, key packaging technologies made at the 400,000-square-foot factory include array process ball grid array (MAPBGA), quad flat pack no-lead (QFN), power quad flat pack no-lead (PQFN), small outline integrated circuit (SOIC), thin quad flat pack (LQFP), plastic dual in-line pin (PDIP) and shrink dual in-line pin (SDIP).
Freescale provides strategic foundry services (gdsii through parametric tested wafers) based on advanced CMOS processes, specialty technologies including SOI, RF, MEMS and Power technologies, with a wide variety of value-added services to bring your ideas to market ahead of your competition. Freescale also offers a variety of electroplating techniques to manufacture bumped interconnects and plated passives using world-class embedded copper passives, power copper, eutectic and low alpha high lead bump interconnects, and spin on passivation with BCB.
In addition, Freescale provides single die, 2D and 3D SiP packaging solutions based on RCP technology for high density heterogeneous integration of ASIC, PMIC, high frequency RF, optical, MEMS, sensors and passive components.
Freescale's competitive portfolio of technologies enables all integrated communication and system solutions.
Our Foundry team is proud to present "state-of-the-art" design kits for our technologies along with exceptional support programs to fit the customer's needs. Our design kits provide internally developed standard cells and I/O libraries and options for memories. Our design kits support EDA tools and design flows.
Our support programs are structured to assist customers of various skill levels – from highly trained to novices. We provide facilities to drop off customers' GDSII files. Customers have access to their production inventory reports which are updated daily.
To learn more about the design kits and our support programs, please contact the Foundry Services Group.