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PRODUCT AND PROCESS CHANGE NOTIFICATION
Generic Copy

ISSUE DATE:11-Jun-2013
NOTIFICATION:15707
TITLE:P2020/P2010 Single Diameter and PdCu Wire Migration
EFFECTIVE DATE:09-Sep-2013

DEVICE(S)
MPN
P2010NSE2HFC
P2010NSE2HHC
P2010NSE2KFC
P2010NSE2KHC
P2010NSE2MFC
P2010NSE2MHC
P2010NSN2HFC
P2010NSN2HHC
P2010NSN2KFC
P2010NSN2KHC
P2010NSN2MFC
P2010NSN2MHC
P2010NXE2HFC
P2010NXE2HHC
P2010NXE2KFC
P2010NXE2KHC
P2010NXE2MHC
P2010NXN2HFC
P2010NXN2HHC
P2010NXN2KFC
P2010NXN2KHC
P2010NXN2MHC
P2020NSE2HFC
P2020NSE2HHC
P2020NSE2KFC
P2020NSE2KHC
P2020NSE2MFC
P2020NSE2MHC
P2020NSN2HFC
P2020NSN2HHC
P2020NSN2KFC
P2020NSN2KHC
P2020NSN2MFC
P2020NSN2MHC
P2020NXE2HFC
P2020NXE2HHC
P2020NXE2KFC
P2020NXE2KHC
P2020NXE2MHC
P2020NXN2HFC
P2020NXN2HHC
P2020NXN2KFC
P2020NXN2KHC
P2020NXN2MHC
P202ESSE2MFC
SCWP2020C



AFFECTED CHANGE CATEGORIES
  • ASSEMBLY PROCESS

  • BILL OF MATERIAL CHANGE (SAME ASSEMBLY SITE)


  • DESCRIPTION OF CHANGE

    Freescale has proactively invested in developing a Palladium-Copper (PdCu) wire bond process to manage the impact of escalating gold prices. To date, Freescale has been absorbing the cost adders of increasing gold related expenses but now has a clear plan to migrate production to PdCu to avoid passing on these additional manufacturing costs.

    The PBGA packages for the devices listed in this notification are currently being assembled at Freescale-KLM using gold (Au) wire bonding. Freescale-KLM sourced material is being qualified by Freescale to use (PdCu) wire bond in addition to the current Au wire bond. 

    Upon PCN expiration, customers may begin receiving Au wire bonded product and PdCu wire bonded product interchangeably under the current production part number.  Freescale manufacturing processes provide Au and PdCu wire bond traceability given any packaged component’s part number and trace code.

    Customers may place prototype orders of the non-qualified KLM PdCu wire bond parts. We are offering prototype part numbers, as shown in the list below:

    P2010PXE2MHC
    P2020PXE2MHC

     

     

     



    REASON FOR CHANGE

    Palladium-Copper wire is being added as additional wire bond material.

    Single-diameter wire bond improves supply assurance.



    ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

    No impact to form, fit, function or reliability.




    Freescale will consider specific conditions of acceptance of this change submitted within 30 days of receipt of this notice on a case by case basis. To request further data or inquire about the notification, please enter a Service Request.

    For sample inquiries - please go to www.freescale.com

    QUAL DATA AVAILABILITY DATE:     05-Aug-2013

    QUALIFICATION STATUS:     IN PROCESS

    QUALIFICATION PLAN:

    Single diameter wire qualification has been completed. See "Reliability Data Summary" section for results. 

     

    PdCu qualification:

    P1020 is the qualification vehicle (QV) and P2020 product family will be qualifying by similarity (QBS).

     

    Table 1: Summary of Qualification Requirements

      Device P1020 P2010 / P2020
    Substrate TEPBGA-II 689 31SQ TEPBGA-II 689 31SQ
    REL Stresses PC THB, uHAST, TC TC
    MSL CZ 5x1 QBS
    THB 77x3 QBS
    uHAST 77x3 QBS
    TC 77x3 25x3
    HTSL 30x3 QBS



    RELIABILITY DATA SUMMARY:

     

    Table 2: Summary of Single Diameter Wire Qualification Results

      Device P2010 P2020
    Substrate TEPBGA-II 689 31SQ TEPBGA-II 689 31SQ
    REL Stresses PC TC TC
    MSL CZ 0/240 QBS
    TC 0/240 QBS

     

     

     

     

    PdCu qualification report will be available approximately 60 days after the issuance of this PCN.



    ELECTRICAL CHARACTERISTIC SUMMARY:

    Electrical characterization data for single-diameter wire bond is attached to this PCN. .

     

    Electrical characterization report for PdCu wire bond will be available approximately 60 days after the issuance of this PCN.





    CHANGED PART IDENTIFICATION:

    There is no change to orderable part numbers or markings for parts assembled with single-diameter PdCu wire bond. PdCu and gold wire bonded parts will ship interchangeably under the existing production part numbers. 



    SAMPLE AVAILABILITY DATE: 04-Jun-2013



    ATTACHMENT(S):
    External attachment(s) FOR this notification can be viewed AT:
    15707_P2020_P2010_SingleDiameterWire_ElectricalCZAnalysis.pdf