MOTOROLA                          Issued: 27-MAR-2000
 Semiconductor Products Sector     Issuing Division: SESG (A)


 TO:
   NAME: GPCN-SPS DISTRIBUTION-LIST
   EMAIL ADDRESS: GPCNDIS1@email.sps.mot.com

 Subject: MOTOROLA PRODUCT BULLETIN  5522

 TITLE: NEW 68EC060 & 68LC060 TBGA SUBSTRATE

 EFFECTIVE DATE: 28-MAR-00

 AFFECTED CHANGE CATEGORIES
   Package Change


 AFFECTED PRODUCT DIVISIONS
   NETWORKING SYSTEMS DIV (NN)        WIRELESS COMMUNICATIONS DIV (VC)
   WIRELESS INFRASTRUCTURE SYS DIV (  SESG (A)

 ADDITIONAL RELIABILITY DATA: None                          Ref: RXA150

 SAMPLES: Contact Local Sales
 Contact your local Motorola Sales Office.

 For any questions concerning this notification:
 REFERENCE:MARTY ALKIS          PHONE: 512-895-8921

 DISCLAIMER:

 MOTOROLA CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
 OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
 MOTOROLA SALES OFFICE.

 **********************************************************************
                            PRODUCT BULLETIN
 **********************************************************************
 ISSUE DATE: 27-Mar-2000                            NOTIFICATION #:5522
 EFFECTIVE DATE: 28-Mar-2000                  ISSUING DIVISION:SESG (A)

 DESCRIPTION AND PURPOSE
 -----------------------
 Motorola is pleased to announce that our 68EC060ZU and 68LC060ZU
  TBGA devices are converting to a new substrate.  The new substrate
 will improve the package quality and reliability of the TBGA product
 line.

 The design of the new substrate prevents solder from migrating from
 the solder balls to under the solder mask during re-flow processes.
 In addition, a new die attach material has been applied for
 reliability improvement.

 There are no changes in form, fit, or function as a result of these
 improvements.

 There are no changes in wafer processing or test methodology for
 this product line.

 QUALIFICATION PLAN
 ------------------
 Please see Reliability Data Summary

 RELIABILITY DATA SUMMARY
 ------------------------
 68EC060 & 68LC060 304 TBGA XC QUAL RESULTS


         DEVICE: XPC060  ASSEMBLY SITE:  ASAT, Hong Kong
         MASK SET:       G59Y    PACKAGE:        304 TBGA
         DIE SIZE:       438.7 X 366.9 mils      # OF LOTS:      3

         PC = Preconditioning to MSL 4

 MOISTURE CHARACTERIZATION

 REL JOB         Level 4
 858107-R1       0/10
 858111-R1       0/10
 858109B         0/10
 TOTAL           0/30


 TEMPERATURE CYCLING (-65!C/+150!C)

 REL JOB         PC      100 Cyc
 858107-R1       0/77    0/77
 858111-R1       0/77    0/76
 858109B         0/77    0/77
 TOTALS          0/231   0/230

 THB (+85!C/85%RH/5.0V)

 REL JOB         PC      168 Hr  504 Hr
 858111-R1       0/77    0/77    0/77
 858109B         0/77    0/77    0/77
 858107-R1       0/77    0/77    In Process
 TOTALS          0/231   0/231   0/154

 AUTOCLAVE (+121!C/15PSIG)

 REL JOB         PC      48 Hr   144 Hr
 858111-R1       0/130   0/130   In Process
 858109B         0/94    0/94    In Process
 TOTALS          0/224   0/224

 BALL SHEAR/SCAN DATA

                 Segment Segment
 REL JOB         Error   Fallout
 d20548993       1/1670  0.06%
 d20943992       0/1885  0.00%
 d212499913      0/1505  0.00%

 ELECTRICAL CHARACTERISTIC SUMMARY
 ---------------------------------
 na

 CHANGED PART IDENTIFICATION
 ---------------------------
 There are no Motorola part number changes.


 AFFECTED DEVICE LIST (WITHOUT SPECIALS)
 ---------------------------------------
 PC68LC060ZU50E  , SC414418ZU50E   , SC414419ZU66E   , SC414420ZU75E
 SPAKEC060ZU50E  , SPAKEC060ZU66E  , SPAKEC060ZU75E  , SPAKLC060ZU50E
 SPAKLC060ZU66E  , SPAKLC060ZU75E  , XC68EC060ZU50E  , XC68EC060ZU66E
 XC68EC060ZU75E  , XC68EC060ZUE    , XC68LC060ZU50E  , XC68LC060ZU66E
 XC68LC060ZU75E  , XC68LC060ZUE

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