Energy Management Technology

No matter the market or application, we understand that power and energy management are one of the biggest challenges you face. That’s why everything we do is designed around power management.

Low-Power Innovations in Our Processes and Techniques

  • Active well bias
  • Metallization IR drop reduction
  • Dynamic voltage frequency scaling
  • Dynamic process temp control
  • Level shifting
  • State retention power gating
  • Ultra low leakage transistors/circuit tech
  • Dynamic correction of timing in DVFS

Low-Power Innovations in Our Transistors

  • High mobility/injection velocity (STRAIN)
  • High drive current for low intrinsic delay
  • Retain gate control over channel
  • Minimize OFF-state drain-source leakage
  • Reduced extrinsic resistance (ErSi, PrSi)
  • Low K spacers
  • Laser anneals
Gate Dialectric
  • Gate leakage/scaling
  • Reduced power consumption
Metal Gates
  • Gate depletion

Our View of Energy Conservation

We take a holistic approach to controlling a system’s energy. We look at process, circuits, architecture, platform, design methodology and system software; using design techniques that tune our systems for the best power/performance ratio.

System Software
  • Dynamic system monitoring (app, OS, middleware, hardware)
  • Intelligent dynamic control (in time, temperature)
Design Methodology and Tools
  • System-to-silicon IC design optimization across power, throughput, latency, area constraints
Platform Techniques
  • Power trees
  • Connectivity of components
  • Platform power modes
Architectural Techniques
  • Heterogeneous processing resource optimization: MCU, DSP, accelerators, functional processing units
Circuit Techniques
  • Hardware support for power gating
  • Low-power idle modes
  • Workload monitoring
  • Dynamic proc/temp compensation
Process Technology
  • Transistor design
  • Low-power technology libraries
  • Capability to mix and match devices with different threshold voltages and gate oxides

Featuring Our 90nm Low-Power Technology

Our 90nm low-power CMOS technology and transistor innovation are challenging standards limits on power, energy, and size.

  • MAX91321–3G Baseband
  • ARM 1136 @ 532Mhz, StarCore DSP
  • Over 101 million transistors
  • Six to nine layers of Cu metal
  • Dynamic voltage and frequency
  • Units with a <70nm minimum feature size

Energy-Efficient Solutions